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[HOME] [KEY STAGE 3] [KEY STAGE 4] [AS - A LEVEL] [GLOSSARY]
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You will remember from earlier work in KS3 and KS4 that solid materials are divided into 3 groups when we examine their electrical properties. The three groups are:
The group which a particular material falls into depends on the behaviour of the valence electrons in the outermost orbit of the atoms of which it is composed. In the case of an insulator such as polystyrene, the valence atoms form tight 'bonds' which are difficult to break. Very few free electrons are available to conduct an electric current. A conductor such as copper on the other hand has a large number of free electrons present. The valence atoms form very weak bonds and are able to drift freely from atom to atom.
A p-n junction cannot be made by simply sticking a piece of p-type material to a piece of n-type, it would not work. The diagrams above are simply representations to aid understanding. The actual process is a little more complex, but is worth describing. The first step is to grow a single crystal of silicon. This is achieved by melting very pure silicon together with very accurately controlled amounts of impurity in an inert atmosphere until completely molten. A small perfect 'seed' crystal is introduced into the surface of the melt and slowly withdrawn. A single crystal ingot about 50mm in diameter is produced. It is usually p-type silicon because it is easier to manufacture semiconductor devices using this material. The ingot is further purified and then cut into thin slices with a diamond saw and polished to an almost flawless finish. The surface of the p-type material is exposed in a diffusion furnace to a vapour of phosphorous or arsenic so that the topmost layer is converted to n-type silicon. The p-type silicon remains underneath, so that within the single crystal structure we have a p-type layer separated from an n-type layer by the depletion layer mentioned earlier. To prevent contamination a layer of silicon oxide (an excellent insulator) is grown on the surface by exposing the silicon slice to steam and oxygen at high temperature.
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